Ikhaya> Izindaba> Isingeniso sokuqondisa isibopho se-ceramic substrate (DBC).
November 27, 2023

Isingeniso sokuqondisa isibopho se-ceramic substrate (DBC).

Inqubo ye-DBC Ceramic Subsestrate ukwengeza izinto ze-oxygen phakathi kweCopper nama-Ceramics, thola uketshezi lwe-Cu-o ekushiseni kwe-1065 ~ 1083 ° C, bese uphendula ukuze uthole isigaba esiphakathi (ukuze uqaphele inhlanganisela ye-CU PLATE kanye ne-ceramic substrate Chemical Metallurgy, futhi ekugcineni ngobuchwepheshe be-Lithography ukufezekisa ukulungiswa kwephethini, kwakha isekethe.

I-Ceramic PCB Substrate ihlukaniswe izingqimba ezi-3, kanye nezinto zokufaka ezifakiwe phakathi yi-Al2o3 noma i-ALN. Ukuvuselelwa okushisayo kwe-Al2o3 ngokujwayelekile kungu-24 w / (m · k), kanye nokuvuselelwa okushisayo kwe-Aln kungu-170 w / (m · k). I-coefficie yokwanda okushisayo kwe-DBC Ceramic Substrate ifana neyakwa-Al2o3 / ALN, okusondele kakhulu ku-coefficion ekwandiswa okushisayo kwezinto ezikhohlisayo ze-LED, ezinganciphisa kakhulu i-arpital cindezelo ekhiqizwe phakathi kwe-chip kanye ne-ceramic engenalutho substrate.


Merit :

Ngoba i-foil ye-Copper inokuvuka okuhle kukagesi nokusebenza okushisayo, futhi i-alumina ingalawula ngempumelelo ukwanda kwe-CU-AL2O3-CU, ukuze i-DBC substrate ine-coefficion yokunwebeka okufana ne-alumina, i-DBC inezinzuzo ezinhle Ukuvuselelwa okushisayo, ukufakwa okunamandla kanye nokuthembela okuphezulu, futhi kusetshenziswe kabanzi ekuphaketheni kwe-IGBT, LD ne-CPV. Ikakhulu ngenxa ye-foil ye-fropper elibanzi (100 ~ 600μm), inezinzuzo ezisobala emkhakheni we-Igbt kanye ne-LD Packal.

Akwanele :

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Ezinhlelweni zokulungiselela i-DBC substrate, izinga lokushisa le-eutectic kanye nokuqukethwe komoya-mpilo kudingeka kulawulwe ngokuqinile, futhi isikhathi sokushisa se-oxidation kanye namazinga okushisa angu-oxidation yimihlaseli emibili ebaluleke kakhulu. Ngemuva kokuthi i-foil ye-copper i-oxidized, isikhombimsebenzisi esibophayo singakha isigaba se-cuxoy esanele ukuze simanzi i-al2o3 ceramic ne-copper, ngamandla aphezulu abophayo; Uma i-foil ye-copper ingekho ngaphambili, i-cuxoy yokukhula imbi, futhi inani elikhulu lezimbobo nezinkinga zizohlala esibonelweni se-bonding, kunciphisa amandla okubopha kanye nokusebenza okushisayo. Ukulungiswa kwezigatshana ze-DBC kusetshenziswa ama-ALN CERAMICS, kuyadingeka futhi ku-Oxidizeze i-Ceramic Substrates, yakha amafilimu we-Al2o3, bese uphendula nge-Folip Films yokusabela kwe-eutectic.

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