Isingeniso sokuphrinta amafilimu okuphrinta ama-ceramic substerstrate (TPC)

Ukuphrinta okuthe xaxa kwe-ceramic substerstrate (TPC) ukumboza ukunamathisela kwensimbi ku-ceramic subrestrate ngokuphrinta kwesikrini, bese ufaka amazinga okushisa aphezulu (ngokuvamile angama-850 ° C ~ 900 ° C.) ukulungiselela i-TPC substrate ngemuva kokomiswa.

I-TFC substrate inenqubo elula yokulungiselela, izidingo eziphansi zokucutshungulwa kwemishini nemvelo, futhi inezinzuzo zokusebenza kahle kokukhiqiza kanye nezindleko eziphansi zokukhiqiza. Okubi yilokho ngenxa yokulinganiselwa kwenqubo yokuphrinta yesikrini, i-TFC substrate ayikwazi ukuthola imigqa ephezulu (min. Ububanzi obubanzi / umugqa we-100 μm> 100 μm). Ngokuya nge-viscosity ye-askere yensimbi kanye nosayizi we-mesh, ukushuba kwesendlalelo sensimbi esilungiselelwe ngokuvamile 10 μm μm. Uma ufuna ukukhulisa ubukhulu bengqimba yensimbi, ingatholakala ngokuphrinta okuningi kwesikrini. Ukuze unciphise izinga lokushisa lesono futhi uthuthukise amandla okubopha phakathi kwesendlalelo sensimbi kanye ne-substrate engenalutho ye-ceramic, inani elincane lesigaba sengilazi livame ukungezwa ku-metal paste kanye nokuvuselelwa okushisayo kwesendlalelo sensimbi. Ngakho-ke, i-TPC substrates isetshenziswa kuphela ekuphazisweni kwamadivayisi kagesi (njenge-elekthronikhi yezimoto) engadingi ukunemba okuphezulu kwesifunda.

Ubuchwepheshe obubalulekile be-TPC Substrate buka ukulungiswa kwe-paste yensimbi ephezulu. Ukunameka kwensimbi ikakhulukazi kwakhiwa i-powder yensimbi, inkampani ye-organic ne-powder yengilazi. Imisipha ye-Conductor etholakalayo ku-Aste yi-AU, AG, NI, CU, no-Al. Ama-pastes asuselwa ku-Silver-based asetshenziswa kabanzi (accounting isikhathi esingaphezu kwama-80% emakethe yensimbi yensimbi) ngenxa yokusebenza kwawo okuphezulu nokwenziwa okushisayo kanye nentengo ephansi kakhulu. Ucwaningo lukhombisa ukuthi ubukhulu bezinhlayiyana ne-morphology yezinhlayiya zesiliva kunethonya elikhulu ekusebenzeni kwesendlalelo esele, kanye nokuvusezwa kwesendlalelo sensimbi kuncipha njengoba izinhlayiya zesiliva eziyindilinga ziyancipha.

Isithwali se-organic ku-metal paste sinquma uketshezi, amandla futhi abumbane namandla okunamathisela, okuthinta ngqo ikhwalithi yokuphrinta kwesikrini nokubumba kwefilimu eyakhiwe ngemuva kwesikhathi. Ukungeza i-Glass Frit kunganciphisa izinga lokushisa lesono lokunamathisela kwensimbi, ukunciphisa izindleko zokukhiqiza kanye ne-ceramic PCB substrate stress.