ISINGENISO SOKUQHAWULA KWE-PRET CERPER CERAMIC REAMIC REAMCIC (DPC)

Inqubo yokulungiselela i-DPC Ceramic Substrate ikhonjiswa kwisibalo. Okokuqala, i-laser isetshenziselwa ukulungiselela izimbobo ku-substrate ye-ceramic engenalutho (i-aperture ngokuvamile i-60 μm), bese kuthi i-ceramic substrate ihlanzwa ngamagagasi e-ultrasonic; Ubuchwepheshe be-Magnetron Sputtering busetshenziselwa ukuletha insimbi ebusweni be-ceramic substrate. Ungqimba lwembewu (TI / CU), bese uqedela ukukhiqizwa kwesendlalelo kwesekethe nge-Photolithography and Development; Sebenzisa i-Electroplating ukugcwalisa izimbobo futhi uqweqwe isendlalelo se-Metal Circuit, futhi uthuthukise ukumelana nokuqina kwe-oxidation kwe-substrate ngokusebenzisa ukwelashwa komhlaba, bese ekugcineni ususe ifilimu eyomile, uqoqe i-etch imbewu yembewu ukuze uqedele ukulungiswa kwembewu.

Isiphetho sangaphambili sokulungiselela i-DPC Ceramic Subsestrate Ukulungiselela Ubuchwepheshe be-Semiconductor Micromachining Technology (I-Sputter Coating, i-Lithography, ukuthuthukiswa kwe-Adopt Technology (PCB) Ukulungiselela Ubuchwepheshe (Plep) Ukugaya, ukugcwaliswa kwephethini, indawo yokugaya, i-etching, ingaphezulu Ukucutshungulwa, njll.), Izinzuzo zobuchwepheshe zisobala.

Izici ezikhethekile zifaka:

. I-substrate ilungele kakhulu ukunemba kwe-Microelectronic Idivaysi yedivayisi enezidingo eziphakeme;

.

.

. Ukufingqa, i-DPC substrate inezimpawu zokunemba okuphezulu nokuxhumeka okuphezulu, futhi kuyinto engaphansi ye-PCB ye-PCB yangempela.

Kodwa-ke, ama-substrates e-DPC nawo anamaphutha athile:

(1) Ungqimba wesifunda lwensimbi lulungiselelwe inqubo ye-electroplating, ebangela ukungcoliswa okukhulu kwemvelo;

. _

Njengamanje, ama-DPC ceramic substrates asetshenziswa ikakhulukazi emaphaketheni aholwa amandla aphezulu.